Low pressure and temperature welding has the ability to improve electronic device
function and fabrication. Currently there are important implications in bottom-up manufacturing
and advantages to stable and strong circuit interconnects. Improvements in the low pressure and
temperature welding can improve device modularity and in turn device functionality. In this
paper, elastomer aided gold to gold welding is investigated. Elastomer aided welding has
implications in the expanding field of flexible electronic device in addition to bottom-up
manufacturing. Throughout this project gold to gold elastomer aided welding is analyzed across
various temperatures (100℃, 150℃, 200℃, 250℃, and 300℃) with an applied clamp pressure
estimated to be 1.5kg. From these tests, it is hypothesized that elastomer aided gold welding
helps to lower the critical weld temperature and pressures, and can even lead to welding under
ambient conditions. Evidence of welding was reported at temperatures as low as 100℃, while the
typical critical weld temperature under like pressure conditions exists at around 150℃.
