<oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><dc:title>Cold Sintering of Zinc Oxide Polyimide Composites with Internally Tunable Electrical Properties via Polymer Crosslinking</dc:title><dc:creator>Vetser, Adam </dc:creator><dc:subject>cold sintering</dc:subject><dc:subject>sintering</dc:subject><dc:subject>ceramics</dc:subject><dc:subject>polymers</dc:subject><dc:subject>composites</dc:subject><dc:subject>ceramic-polymer composites</dc:subject><dc:subject>varistors</dc:subject><dc:subject>impedance spectroscopy</dc:subject><dc:subject>polyimide</dc:subject><dc:subject>ZnO</dc:subject><dc:subject>zinc oxide</dc:subject><dc:subject>composite cold sintering</dc:subject><dc:subject>crosslinking</dc:subject><dc:subject>internal polymer crosslinking</dc:subject><dc:subject>RTM370</dc:subject><dc:coverage>Materials Science and Engineering</dc:coverage><dc:relation>B S</dc:relation><dc:description>This thesis investigates the fabrication, microstructure, crosslinking, and bulk electrical properties of a ZnO polyimide composite. Single step processing for ceramic-polymer composites has been unattainable due to the gap between ceramic and polymer processing temperatures using traditional sintering methods &gt;1000°C. The cold sintering process (CSP) of ZnO occurs at 250°C, allowing for the integration of polymeric materials below their crosslinking temperature without degradation. Five methods of dispersing the polyimide in ZnO were investigated with the goal of obtaining a homogenous polymer dispersion and high density. Integration of the polyimide to ZnO through the creation of a polymer dispersion in an organic solvent yielded a 94.7% relatively dense composite. Electrical impedance spectroscopy (EIS) was used to characterize the bulk electrical properties of the composite before and after crosslinking at 380°C. Resistivity was shown to decrease by an order of magnitude while the activation energy for electron conduction increased after crosslinking. A mechanism for polyimide crosslinking was proposed using Fourier-transform infrared spectroscopy (FTIR) to explain the observed electrical trends. Ceramic-polymer composites offer applications including semiconductors, piezoelectrics, varistors, and solar cells. The development of single step ceramic-polymer composite processing could allow for devices with internally tunable electrical properties as a function of applied heat.</dc:description><dc:contributor>Clive A Randall, Thesis Supervisor</dc:contributor><dc:contributor>Robert Allen Kimel, Thesis Honors Advisor</dc:contributor><dc:rights>open_access</dc:rights><dc:date>2022-04-15T14:17:58Z</dc:date><dc:identifier>https://honors.libraries.psu.edu/catalog/7993ajv5394</dc:identifier></oai_dc:dc>